IEC Today Announces Winners of Highly-Coveted DesignVision Awards at DesignCon 2008

The International Engineering Consortium (IEC) today announced the best design tools of 2008 before hundreds of industry professionals live at DesignCon 2008, its annual semiconductor engineering event in Silicon Valley
DesignCon 2008

SANTA CLARA, Calif.--(BUSINESS WIRE)--The International Engineering Consortium (IEC) honored the DesignVision winners this afternoon before the Tuesday Keynote Address at DesignCon 2008; the conference and exhibition continues until Thursday this week at the Santa Clara Convention Center in Santa Clara, CA.

“This year’s winners exemplify the highest level of innovation in today’s industry,” commented IEC Executive Vice President Roger Plummer. “We are pleased to congratulate all of the winners and recognize the products that received the 2008 DesignVision Award here at DesignCon!”

Winners were selected among 25 finalists who were chosen from among a record-breaking number of submissions and ranked by a panel of judges selected from the 2008 DesignCon Technical Program Committee. This year's Technical Program Committee consisted of 115 of the industry's top experts who served in the development of more than 120 sessions making up this year’s educational program.

In each of the eight categories, the 2008 DesignVision winners include the following companies and products respectively:

ASIC and IC Design Tools

* Cadence Design Systems, Inc. – Cadence Litho Electrical Analyzer

Design Verification Tools

* Mentor Graphics and Cadence Design Systems, Inc. – Open Verification Methodology

Interconnect Technologies and Components

* Amphenol TCS – XCede

Semiconductors and ICs

* Altera Corporation – Stratix III FPGA

Semiconductors and ICs (IP)

* Rambus – The XDR™ Memory Architecture

Structured/Platform ASIC, FPGA, and PLD Design Tools

* Lattice Semiconductor – LatticeXP2 FPGA Family

System-Level Design Tools

* FuturePlus Systems, Corp. – FS5000 Jitterlyzer

Test and Measurement Equipment

* Agilent Technologies – Agilent N6705A DC Power Analyzer

The award-winning products will be on display today and tomorrow on the DesignCon 2008 exhibition floor. The DesignCon 2008 exhibition will also feature EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies and more. It will bring box and board designers together with chip designers and others involved in system-level design.

Major sponsors of the event include Official Host Sponsor Agilent Technologies; Rambus; LeCroy; Tektronix; BERTScope; Amphenol; Cisco; Hewlett Packard; IBM; Intel; Redback Networks; Sun Microsystems; Xilinx; and Wipro.

Visit www.designcon.com/2008/ for full information or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.

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