Springsoft Provides Access to More Data
At times it’s seemed a sotto-voce religious war.
One side says that a clean user interface aids productivity. The other side says that, well, quite frankly, a graphic user interface (GUI) is a toy, not meant for serious work.
One side says that command-line work is the only real way to do things; the other makes the accusation of engineers trying to keep things obscure and difficult as a form of job security.
With a Little Guy Trying to Exert Some Power of His Own
It was a bit after 5, right around time to go home. Which, of course, has nothing to do with the time when people actually go home in Silicon Valley.
Except this one particular day.
It was Loma Prieta day. The earthquake that interrupted the World Series. I seem to recall finding myself under my desk, trying to grip the carpet to keep from going airborne due to the shaking. Books tumbled from my bookcase onto the chair where I had been sitting seconds before. This one was definitely different.
A Look at Wide-Bandgap Materials
Assumptions are always dangerous, but there’s one reasonably safe assumption you can make about our IC-related topics: the underlying material is most likely silicon. Silicon is so dominant that anything else is considered fringe or boutique.
But if you keep your eyes open at technology conferences, the phrase “wide-bandgap materials” is becoming increasingly evident, with two compounds, GaN and SiC, dominating that discussion. These two substances tend to be treated separately and in isolation, whether in conference sessions or articles or papers. Which leaves unanswered the obvious big-picture questions: why two materials? Do they compete with or complement each other? And are there other wide-bandgap materials in the offing? And, at an even more basic level, why are we doing this at all?
Part 3 – Board Temperature
In electronics systems, the board temperature adjacent to the component often is known or controlled as a part of the system design. This means that by measuring the board temperature during operation, you can estimate the component’s junction temperature. You can use the thermal parameter Psi-JB (ΨJB) for this purpose since it is unique to a particular device, and is generally provided by the component manufacturer. This Part 3 in this three-part series details the proper method to determine the component junction temperature by measuring the board temperature. By carefully addressing component temperature, you can ensure operation within the thermal limits of the component.
Part 2 – Case Temperature
In electronics systems, the case temperature (sometimes referred to as top temperature) of a component often is easy to measure. Fortunately, the component case temperature is very close, both physically and thermally, to the component junction temperature. This means that you can estimate the component’s junction temperature by measuring it’s case temperature during operation. You can use the thermal parameter Psi-JT (ΨJT) for this purpose since it is unique for a particular component under typical use conditions, and is generally provided by the component manufacturer. This article details the proper method to determine the component junction temperature by measuring the case temperature. By carefully addressing component temperature, you can ensure operation within the thermal limits of the component.
It is well known that IC components heat up during operation as they dissipate power while doing their analog and digital magic. But how can the user determine if a component (semiconductor device) is too hot? Many engineers have seen videos on this or may even have personal lab experience with overloaded components which start to smoke or melt. What is not commonly known, however, is that well below this temperature the component function or reliability starts to degrade. How can you be certain that each component in an electronic system is within its safe operating range?